- 目錄
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第1篇 ic版圖設(shè)計(jì)工程師崗位職責(zé)
ic版圖設(shè)計(jì)工程師 創(chuàng)達(dá)特(蘇州)科技有限責(zé)任公司 創(chuàng)達(dá)特(蘇州)科技有限責(zé)任公司,創(chuàng)達(dá)特,創(chuàng)達(dá)特 職責(zé)描述:
1.本科學(xué)歷,電子/微電子相關(guān)專業(yè);
2.三年以上工作經(jīng)驗(yàn),熟悉ic設(shè)計(jì)基本流程;
3.熟練使用ic版圖設(shè)計(jì)工具(熟練virtuoso 61者優(yōu)先),熟悉cmos工藝流程;
4.有40nm或65nm設(shè)計(jì)經(jīng)驗(yàn)者更佳;
5.良好的英語(yǔ)讀寫能力;
6.能嚴(yán)格遵守公司及客戶公司的相關(guān)管理規(guī)章;
7.具有良好的溝通能力和團(tuán)隊(duì)合作精神,與同事及客戶同事相處融洽,吃苦耐勞。
第2篇 高級(jí)asic驗(yàn)證工程師職位描述與崗位職責(zé)任職要求
職位描述:
崗位職責(zé):
搭建模塊級(jí)和系統(tǒng)級(jí)uvm驗(yàn)證環(huán)境
根據(jù)設(shè)計(jì)需求文檔制定模塊級(jí)和系統(tǒng)級(jí)驗(yàn)證方案,跟設(shè)計(jì)工程師一起審查設(shè)計(jì)和驗(yàn)證
驗(yàn)證整個(gè)設(shè)計(jì),調(diào)試各種錯(cuò)誤與設(shè)計(jì)中的bug
管理驗(yàn)證的審查,建立代碼質(zhì)量的標(biāo)準(zhǔn)
崗位要求:
碩士及以上學(xué)歷,三年以上相關(guān)工作經(jīng)驗(yàn)
精通verilog,systemverilog,sva及腳本語(yǔ)言(perl, shell等)
精通uvm驗(yàn)證的工具和環(huán)境
有視頻編解碼,圖像處理和外設(shè)(mipi、usb,存儲(chǔ)控制器等)調(diào)試經(jīng)驗(yàn)者優(yōu)先
具有較強(qiáng)的溝通、學(xué)習(xí)和撰寫英文文檔的能力
responsibilities:
build system and unit-level uvm verification environment
create system and unit-level verification plans from specification and review with design engineers
debug failures and manage bug tracking
conduct verification reviews and set standard for coding quality
qualifications:
master degree or above, with 3+ years working e_perience
proficiency in system verilog, object oriented programming, scripting languages
e_perience in uvm development a plus
e_perience in debugging designs of video codec, isp and peripherals (mipi, usb, memory controller, etc.) is a plus
e_cellent written, verbal and presentation skills
第3篇 ic銷售工程師崗位職責(zé)
ic銷售工程師 寶德科技 寶德科技集團(tuán)股份有限公司,寶德科技,寶德 崗位職責(zé):
1、開(kāi)發(fā)客戶,負(fù)責(zé)公司代理的ic芯片的推廣
2、加強(qiáng)應(yīng)收,避免逾期賬款
崗位要求::
1、熟悉電源ic,熟悉鋰電池保護(hù)市場(chǎng),有dc-dc,mosfet的成功銷售經(jīng)驗(yàn)
2、具有豐富的dc-dc、mosfet終端客戶資源和客戶關(guān)系,業(yè)績(jī)優(yōu)秀
3、具備較強(qiáng)的市場(chǎng)分析、推廣能力和良好的人際溝通、協(xié)調(diào)能力,對(duì)市場(chǎng)發(fā)展趨勢(shì)比較敏感
第4篇 集成電路ic設(shè)計(jì)工程師崗位職責(zé)、要求以及未來(lái)可以發(fā)展的方向
上班的公交ic卡,atm取錢的銀行卡,樓宇的門卡等等,在現(xiàn)代世界不可或缺,ic設(shè)計(jì)工程師就是一個(gè)從事ic開(kāi)發(fā)的職業(yè)。隨著中國(guó)ic設(shè)計(jì)產(chǎn)業(yè)漸入佳境,越來(lái)越多的工程師加入到這個(gè)新興產(chǎn)業(yè)中。成為ic設(shè)計(jì)工程師所需門檻較高,往往需要有良好的數(shù)字電路系統(tǒng)及嵌入系統(tǒng)設(shè)計(jì)經(jīng)驗(yàn),了解arm體系結(jié)構(gòu),良好的數(shù)字信號(hào)處理、音視頻處理,圖像處理及有一定的vlsi基礎(chǔ)。
集成電路ic設(shè)計(jì)工程師崗位職責(zé)
1.負(fù)責(zé)數(shù)字電路的規(guī)格定義、rtl代碼編寫、驗(yàn)證、綜合、時(shí)序分析、可測(cè)性設(shè)計(jì);
2.負(fù)責(zé)進(jìn)行電路設(shè)計(jì)、仿真以及總體布局和修改;
3.制作ic芯片功能說(shuō)明書(shū);
4.負(fù)責(zé)芯片的開(kāi)發(fā)和設(shè)計(jì)工作;
5.負(fù)責(zé)與版圖工程師協(xié)作完成版圖設(shè)計(jì),提供技術(shù)支持;
6.及時(shí)編寫各種設(shè)計(jì)文檔和標(biāo)準(zhǔn)化資料,實(shí)現(xiàn)資源、經(jīng)驗(yàn)共享。
集成電路ic設(shè)計(jì)工程師崗位要求
1.有扎實(shí)的電路基礎(chǔ)知識(shí),有一定的集成電路工藝基礎(chǔ),有較強(qiáng)的電路分析能力;
2.熟悉eda的電路設(shè)計(jì)、版圖設(shè)計(jì)及模擬工具;
3.熟悉模擬集成電路設(shè)計(jì)流程和設(shè)計(jì)方法;
4.熟悉模擬集成電路基本構(gòu)造模塊如adc/dac,pll,bandgap,op-amp,comparator,buffer等;
5.能夠設(shè)計(jì)相應(yīng)的集成電路;
6.具有團(tuán)隊(duì)合作能力,解決問(wèn)題能力強(qiáng)。
集成電路ic設(shè)計(jì)工程師發(fā)展方向
可向以下方向發(fā)展:
1.技術(shù)經(jīng)理
2.電子技術(shù)研發(fā)工程師
3.it項(xiàng)目經(jīng)理
第5篇 數(shù)字ic驗(yàn)證工程師崗位職責(zé)
數(shù)字ic驗(yàn)證工程師 崗位職責(zé):
1. 負(fù)責(zé)搭建模塊級(jí)到系統(tǒng)級(jí)可重用的驗(yàn)證環(huán)境及驗(yàn)證平臺(tái);
2. 負(fù)責(zé)編寫測(cè)試用例,并進(jìn)行調(diào)試、收集分析驗(yàn)證覆蓋率;
3. 負(fù)責(zé)改進(jìn)并完善公司的芯片驗(yàn)證流程。
任職要求:
1. 本科及以上學(xué)歷,微電子、電子工程、通信工程類專業(yè);
2. 至少5年以上工作經(jīng)驗(yàn)或有多個(gè)ic設(shè)計(jì)項(xiàng)目的驗(yàn)證經(jīng)驗(yàn);
3. 熟悉asic芯片全開(kāi)發(fā)流程(cot/soc均可);
4. 熟練掌握hdl語(yǔ)言:verilog/systemverilog;
5. 對(duì)驗(yàn)證方法學(xué)的熟練使用:vmm/uvm/ovm之一;
6. 腳本的熟練使用:sh/perl/tcl/makefile/python/ruby。
崗位職責(zé):
1. 負(fù)責(zé)搭建模塊級(jí)到系統(tǒng)級(jí)可重用的驗(yàn)證環(huán)境及驗(yàn)證平臺(tái);
2. 負(fù)責(zé)編寫測(cè)試用例,并進(jìn)行調(diào)試、收集分析驗(yàn)證覆蓋率;
3. 負(fù)責(zé)改進(jìn)并完善公司的芯片驗(yàn)證流程。
第6篇 android graphics系統(tǒng)工程師2792職位描述與崗位職責(zé)任職要求
職位描述:
崗位職責(zé):
1. 分析解決graphics相關(guān)問(wèn)題,維護(hù)圖形服務(wù)模塊;
2. 負(fù)責(zé)圖形顯示模塊性能和功耗調(diào)優(yōu)。
任職資格:
1 .熟練掌握c/c++語(yǔ)言,熟悉java語(yǔ)言開(kāi)發(fā);
2. 兩年以上android平臺(tái)顯示模塊開(kāi)發(fā)經(jīng)驗(yàn);
3. 熟悉android顯示系統(tǒng)原理和實(shí)現(xiàn),如:view、surfaceflinger、hwui、hwcomposer、hal;
4. 精通android圖形性能調(diào)試技術(shù),比如systrace、perf等,善于利用各種資源優(yōu)化性能 (優(yōu)先)
5. 擁有qcom或mtk平臺(tái)顯示模塊開(kāi)發(fā)經(jīng)驗(yàn)(優(yōu)先);
6. 具備圖形顯示模塊性能或功耗調(diào)優(yōu)能力(優(yōu)先);
7. 精通android系統(tǒng)渲染機(jī)制; 熟悉opengl es、opencl或vulkan者(優(yōu)先)
第7篇 ict測(cè)試工程師崗位職責(zé)
ict測(cè)試工程師 ict測(cè)試工程師: 安捷倫3070機(jī)臺(tái)和ict的開(kāi)發(fā)
job description
1. the test engineer is responsible along with the customer to develop the test process and test specifications, that
ensure the customer receives only product that meets their requirements.
2. the test engineer shall constantly upgrade the test process to identify design deficiencies and screen manufacturing
and electrical defects from the customer. he/she shall strive to obtain an optimized test process balancing cost, coverage and test time.
3. the test engineer shall review all assemblies for testability and interact with the customer and design facility to
improve test access, coverage and reduce the cost of test.
4. develop and improves test procedures, tester hardware and software for electronic circuit board production, subject
to established jabil standards. generates reports and performs analysis of test data. initiates changes in testing procedures as assigned.
5. the test engineer shall design and support the build and maintenance of tester and fi_tures as required to meet
customer specific requirements as assigned.
6. the test engineer shall review all test processes and identify untested components.
7. the test engineer shall provide project support related to test and diagnosis.
8. the test engineer shall supply the documentation for all testers, component programmers, and diagnostic/repair processes as assigned.
9. the test engineer shall provide support to the operations department through participation in the continuous
improvement program, and promotion of a 'quality first' mentality.
10. the test engineer shall monitor and contribute to the improvement of test yields, test efficiency, tester intermittencies, electrical defects, and overall tester performance.
11. the test engineer shall ensure comprehensive specifications are produced relating to performance, required standards of quality and conformity for subcontract vendors and shall be required to assess the suitability of a chosen vendor to perform to those criterion.
12. the test engineer shall contribute to the training of test engineering technicians, diagnostic technicians, test operators and component programmers.
13. the test engineer shall work with the diagnosis group to find more efficient ways to diagnose defective assemblies.
14. the test engineer shall investigate new and e_isting test and diagnosis methods to improve e_isting products and support advancing technologies.
15. the test engineer shall introduce control systems to ensure conformity to iso standards and that he/she continually reviews all department systems in order to improve their efficiency and ease of use.
16. the test engineer shall spend time on ongoing education to keep up with new technologies. some e_amples of ongoing education include schooling, reading technical publications, going to seminars, classes and shows.
17. to manage a good level of machine spare parts to ensure minimum production impact due to machine downtime.
18. the test engineer shall adhere to all safety guidelines and actively promote a safety conscious attitude within his/her department.
requirements:
1. above 5 working years.
2. subject: degree in ee or other relevant subject
3. e_perienced on agilent 3070 ict machine or teradyne ict machine
4. e_perienced on troubleshooting ict machine and diagnostic defect units.
5. good communication and cooperation with team.
6. good attitude and accept to work overtime
ict測(cè)試工程師: 安捷倫3070機(jī)臺(tái)和ict的開(kāi)發(fā)
job description
1. the test engineer is responsible along with the customer to develop the test process and test specifications, that
ensure the customer receives only product that meets their requirements.
2. the test engineer shall constantly upgrade the test process to identify design deficiencies and screen manufacturing
and electrical defects from the customer. he/she shall strive to obtain an optimized test process balancing cost, coverage and test time.
3. the test engineer shall review all assemblies for testability and interact with the customer and design facility to
improve test access, coverage and reduce the cost of test.
4. develop and improves test procedures, tester hardware and software for electronic circuit board production, subject
to established jabil standards. generates reports and performs analysis of test data. initiates changes in testing procedures as assigned.
5. the test engineer shall design and support the build and maintenance of tester and fi_tures as required to meet
customer specific requirements as assigned.
6. the test engineer shall review all test processes and identify untested components.
7. the test engineer shall provide project support related to test and diagnosis.
8. the test engineer shall supply the documentation for all testers, component programmers, and diagnostic/repair processes as assigned.
9. the test engineer shall provide support to the operations department through participation in the continuous
improvement program, and promotion of a 'quality first' mentality.
10. the test engineer shall monitor and contribute to the improvement of test yields, test efficiency, tester intermittencies, electrical defects, and overall tester performance.
11. the test engineer shall ensure comprehensive specifications are produced relating to performance, required standards of quality and conformity for subcontract vendors and shall be required to assess the suitability of a chosen vendor to perform to those criterion.
12. the test engineer shall contribute to the training of test engineering technicians, diagnostic technicians, test operators and component programmers.
13. the test engineer shall work with the diagnosis group to find more efficient ways to diagnose defective assemblies.
14. the test engineer shall investigate new and e_isting test and diagnosis methods to improve e_isting products and support advancing technologies.
15. the test engineer shall introduce control systems to ensure conformity to iso standards and that he/she continually reviews all department systems in order to improve their efficiency and ease of use.
16. the test engineer shall spend time on ongoing education to keep up with new technologies. some e_amples of ongoing education include schooling, reading technical publications, going to seminars, classes and shows.
17. to manage a good level of machine spare parts to ensure minimum production impact due to machine downtime.
18. the test engineer shall adhere to all safety guidelines and actively promote a safety conscious attitude within his/her department.
requirements:
1. above 5 working years.
2. subject: degree in ee or other relevant subject
3. e_perienced on agilent 3070 ict machine or teradyne ict machine
4. e_perienced on troubleshooting ict machine and diagnostic defect units.
5. good communication and cooperation with team.
6. good attitude and accept to work overtime
第8篇 芯片asic設(shè)計(jì)工程師職位描述與崗位職責(zé)任職要求
職位描述:
工作職責(zé):
1、為公司芯片提供asic設(shè)計(jì)(pd/dft/dfr/dfm)和工藝開(kāi)發(fā)
2、負(fù)責(zé)芯片asic設(shè)計(jì)平臺(tái)建設(shè),提高效率;
3、負(fù)責(zé)芯片floorplan規(guī)劃,物理可實(shí)現(xiàn)分析、dft/dfd等可測(cè)性設(shè)計(jì)方案制定、設(shè)計(jì)實(shí)現(xiàn),仿真驗(yàn)證,sta時(shí)序分析,ate測(cè)試向量交付等。負(fù)責(zé)實(shí)施從netlist到gds2的所有物理設(shè)計(jì)。
4、設(shè)計(jì)過(guò)程數(shù)據(jù)分析、測(cè)試大數(shù)據(jù)分析、良率提升等
任職要求:
業(yè)務(wù)技能要求:
1、熟練掌握深亞微米后端物理設(shè)計(jì)流程,熟練使用數(shù)字芯片物理設(shè)計(jì)/驗(yàn)證工具;
2、熟悉ic dft或ic邏輯設(shè)計(jì)流程,熟練使用 synopsys 或 mentor 的相關(guān)工具。
專業(yè)知識(shí)要求:
1、具備asic設(shè)計(jì)相關(guān)的知識(shí)和能力,對(duì)新工藝有一定了解;
2、或了解后端物理設(shè)計(jì)流程,有數(shù)字芯片物理設(shè)計(jì)/驗(yàn)證工具相關(guān)經(jīng)驗(yàn);
3、或了解dft或ic邏輯設(shè)計(jì)流程,有eda(synopsys/cadence/ansys/mentor/華大等)工具相關(guān)經(jīng)驗(yàn)
4、或了解python/數(shù)據(jù)庫(kù)/web/tensorflow/ml,具有一定大數(shù)據(jù)分析能力
第9篇 asic設(shè)計(jì)工程師崗位職責(zé)
asic設(shè)計(jì)工程師 職位描述:
1. 理解mac層調(diào)度方法;
2. 負(fù)責(zé)mac層架構(gòu)設(shè)計(jì)和rtl實(shí)現(xiàn);
3. 負(fù)責(zé)mac和soc以及物理層接口設(shè)計(jì);
4. 負(fù)責(zé)mac 層fpga驗(yàn)證;
5. 配合mac層整體的前端綜合和后端timing signoff;
6. 配合提供mac驅(qū)動(dòng)程序;
7. mac層相關(guān)模塊的優(yōu)化和維護(hù);
任職要求:
1. 計(jì)算機(jī)或電子類專業(yè)本科及以上學(xué)歷,1年以上工作經(jīng)驗(yàn);
1. 熟悉arm總線協(xié)議;
2. 熟悉wifi/bluetooth/nbiot/ ethernet 至少一種mac層協(xié)議;
3. 良好的算法理解能力;
4. 熟悉芯片asic前端設(shè)計(jì)流程;
5. 熟練的verilog/c/c++/matlab/perl 等編程能力;
6. 有成功流片項(xiàng)目經(jīng)驗(yàn)者優(yōu)先; 1. 理解物理層算法以及配合物理層算法研發(fā);
2. 負(fù)責(zé)物理層算法的rtl 實(shí)現(xiàn);
3. 設(shè)計(jì)物理層微架構(gòu);
4. 評(píng)估物理層算法實(shí)現(xiàn)后的的性能;
5. 負(fù)責(zé)相關(guān)模塊的模塊級(jí)別驗(yàn)證工作;
6. 負(fù)責(zé)相關(guān)模塊的fpga原型驗(yàn)證工作;
7. 配合相關(guān)模塊的前端綜合和后端timing signoff;
8. 配合底層驅(qū)動(dòng)工程師完善相關(guān)模塊的驅(qū)動(dòng);
9. 物理層相關(guān)模塊的優(yōu)化和維護(hù);
任職要求:
1. 計(jì)算機(jī)或通信類專業(yè)本科及以上學(xué)歷,1年以上工作經(jīng)驗(yàn);
2. 掌握信號(hào)處理算法;
3. 熟悉wifi/bluetooth/nbiot/ethernet/3g/4g/5g 至少一種物理層算法優(yōu)先;
4. 良好的算法理解能力;
5. 熟悉芯片asic前端設(shè)計(jì)流程;
6. 熟練的verilog/c/c++/matlab/perl 等編程能力;
7.有成功流片項(xiàng)目經(jīng)驗(yàn)者優(yōu)先; 職位描述:
1. 理解mac層調(diào)度方法;
2. 負(fù)責(zé)mac層架構(gòu)設(shè)計(jì)和rtl實(shí)現(xiàn);
3. 負(fù)責(zé)mac和soc以及物理層接口設(shè)計(jì);
4. 負(fù)責(zé)mac 層fpga驗(yàn)證;
5. 配合mac層整體的前端綜合和后端timing signoff;
6. 配合提供mac驅(qū)動(dòng)程序;
7. mac層相關(guān)模塊的優(yōu)化和維護(hù);
任職要求:
1. 計(jì)算機(jī)或電子類專業(yè)本科及以上學(xué)歷,1年以上工作經(jīng)驗(yàn);
1. 熟悉arm總線協(xié)議;
2. 熟悉wifi/bluetooth/nbiot/ ethernet 至少一種mac層協(xié)議;
3. 良好的算法理解能力;
4. 熟悉芯片asic前端設(shè)計(jì)流程;
5. 熟練的verilog/c/c++/matlab/perl 等編程能力;
6. 有成功流片項(xiàng)目經(jīng)驗(yàn)者優(yōu)先;
第10篇 amlogic軟件工程師職位描述與崗位職責(zé)任職要求
職位描述:
崗位職責(zé):
負(fù)責(zé)android系統(tǒng)的bsp開(kāi)發(fā)包括不限于以下工作:
1、負(fù)責(zé)android系統(tǒng)中的驅(qū)動(dòng)移植與開(kāi)發(fā);
2、負(fù)責(zé)android 框架的優(yōu)化與定制;
3、負(fù)責(zé)android native 層中子模塊的接口定義與開(kāi)發(fā);
4、負(fù)責(zé)linu_內(nèi)核的裁剪、配置;
5、負(fù)責(zé)bootloader的常規(guī)開(kāi)發(fā)如啟動(dòng)流程,硬件初始化等工作。
任職要求:
1、2年以上androidframework開(kāi)發(fā)經(jīng)驗(yàn),有amlogic方案開(kāi)發(fā)經(jīng)驗(yàn)者優(yōu)先,有amlogic972平臺(tái)開(kāi)發(fā)經(jīng)驗(yàn)的薪資直接上漲50%;
2、本科及以上學(xué)歷,計(jì)算機(jī)相關(guān)專業(yè);
3、擁有android系統(tǒng)模塊的定制修改經(jīng)驗(yàn),如systemui、systemservice(wifi、bluetooth、radio、video、input、eth、powermanage)、ams;(沒(méi)有本條相關(guān)經(jīng)驗(yàn)者勿投)
4、熟悉常規(guī)的系統(tǒng)性能檢測(cè)方法,以及調(diào)試方法;
5、熟悉linu_內(nèi)核開(kāi)發(fā),熟悉dlp,camera,usb,led等外設(shè)驅(qū)動(dòng)開(kāi)發(fā);
6、擁有l(wèi)inu_下的應(yīng)用開(kāi)發(fā)能力,熟悉i2c、spi、串口、v4l2等接口編程;
7、c語(yǔ)言編程能力扎實(shí),熟悉arm體系結(jié)構(gòu);
8、熟悉makefile , shell 腳本的編寫。
第11篇 銷售工程師ic崗位職責(zé)
ic銷售工程師 寶德科技 寶德科技集團(tuán)股份有限公司,寶德科技,寶德 崗位職責(zé):
1、開(kāi)發(fā)客戶,負(fù)責(zé)公司代理的ic芯片的推廣
2、加強(qiáng)應(yīng)收,避免逾期賬款
崗位要求::
1、熟悉電源ic,熟悉鋰電池保護(hù)市場(chǎng),有dc-dc,mosfet的成功銷售經(jīng)驗(yàn)
2、具有豐富的dc-dc、mosfet終端客戶資源和客戶關(guān)系,業(yè)績(jī)優(yōu)秀
3、具備較強(qiáng)的市場(chǎng)分析、推廣能力和良好的人際溝通、協(xié)調(diào)能力,對(duì)市場(chǎng)發(fā)展趨勢(shì)比較敏感
第12篇 高級(jí)ic驗(yàn)證工程師崗位職責(zé)
高級(jí)ic驗(yàn)證工程師 崗位職責(zé):
1. 負(fù)責(zé)制定模塊級(jí)/系統(tǒng)級(jí)的驗(yàn)證計(jì)劃,搭建模塊級(jí)/系統(tǒng)級(jí)驗(yàn)證平臺(tái),編寫模塊級(jí)/系統(tǒng)級(jí)測(cè)試用例,完成模塊級(jí)/系統(tǒng)級(jí)的功能驗(yàn)證。參與芯片后仿真;
2.編寫驗(yàn)證自動(dòng)化腳本,加速驗(yàn)證過(guò)程和提升驗(yàn)證的自動(dòng)化;
3.解決芯片驗(yàn)證過(guò)程中的工具和環(huán)境問(wèn)題。
4.參與芯片bring up調(diào)試。
任職要求:
1.精通芯片驗(yàn)證流程和uvm驗(yàn)證方法學(xué),使用uvm+systemverilog搭建驗(yàn)證平臺(tái);
2.精通verilog和system verilog語(yǔ)言;熟練使用vcs, verdi等主流eda仿真工具;
3.熟悉linu_/uni_環(huán)境,熟悉c/c++,熟練掌握makefile,perl/python等腳本語(yǔ)言;
4.熟悉a_i/ahb等總線協(xié)議;有ssd控制器芯片設(shè)計(jì)驗(yàn)證經(jīng)驗(yàn)優(yōu)先考慮;
5.5年左右設(shè)計(jì)或者驗(yàn)證工程師經(jīng)驗(yàn),有過(guò)至少1個(gè)asic/soc項(xiàng)目的流片經(jīng)驗(yàn);
6.較強(qiáng)的技術(shù)文檔撰寫能力和良好的團(tuán)隊(duì)協(xié)作能力;具備積極的工作態(tài)度,做事認(rèn)真負(fù)責(zé),善于溝通。
職位必備項(xiàng)
學(xué)校類型必須公辦以上學(xué)校
專業(yè)選擇必須電氣工程類,計(jì)算機(jī)科學(xué)與技術(shù)類相關(guān)專業(yè)
學(xué)歷必須統(tǒng)招本科以上學(xué)歷
其他項(xiàng)5年左右設(shè)計(jì)或者驗(yàn)證工程師經(jīng)驗(yàn),有過(guò)至少1個(gè)asic/soc項(xiàng)目的流片經(jīng)驗(yàn)
精通芯片驗(yàn)證流程和uvm驗(yàn)證方法學(xué),使用uvm+systemverilog搭建驗(yàn)證平臺(tái)
職位優(yōu)先項(xiàng)
工作經(jīng)驗(yàn) 5年以上工作經(jīng)驗(yàn)優(yōu)先
技能要求 具備較強(qiáng)的r;建模;集成電路能力優(yōu)先
方向要求 具有芯片;集成電路相關(guān)工作經(jīng)驗(yàn)優(yōu)先
其他項(xiàng) 精通verilog和system verilog語(yǔ)言;熟練使用vcs, verdi等主流eda仿真工具
熟悉linu_/uni_環(huán)境,熟悉c/c++,熟練掌握makefile,perl/python等腳本語(yǔ)言
熟悉a_i/ahb等總線協(xié)議;有ssd控制器芯片設(shè)計(jì)驗(yàn)證經(jīng)驗(yàn)優(yōu)先考慮
崗位職責(zé):
1. 負(fù)責(zé)制定模塊級(jí)/系統(tǒng)級(jí)的驗(yàn)證計(jì)劃,搭建模塊級(jí)/系統(tǒng)級(jí)驗(yàn)證平臺(tái),編寫模塊級(jí)/系統(tǒng)級(jí)測(cè)試用例,完成模塊級(jí)/系統(tǒng)級(jí)的功能驗(yàn)證。參與芯片后仿真;
2.編寫驗(yàn)證自動(dòng)化腳本,加速驗(yàn)證過(guò)程和提升驗(yàn)證的自動(dòng)化;
3.解決芯片驗(yàn)證過(guò)程中的工具和環(huán)境問(wèn)題。
4.參與芯片bring up調(diào)試。
任職要求:
1.精通芯片驗(yàn)證流程和uvm驗(yàn)證方法學(xué),使用uvm+systemverilog搭建驗(yàn)證平臺(tái);
2.精通verilog和system verilog語(yǔ)言;熟練使用vcs, verdi等主流eda仿真工具;
3.熟悉linu_/uni_環(huán)境,熟悉c/c++,熟練掌握makefile,perl/python等腳本語(yǔ)言;
4.熟悉a_i/ahb等總線協(xié)議;有ssd控制器芯片設(shè)計(jì)驗(yàn)證經(jīng)驗(yàn)優(yōu)先考慮;
5.5年左右設(shè)計(jì)或者驗(yàn)證工程師經(jīng)驗(yàn),有過(guò)至少1個(gè)asic/soc項(xiàng)目的流片經(jīng)驗(yàn);
6.較強(qiáng)的技術(shù)文檔撰寫能力和良好的團(tuán)隊(duì)協(xié)作能力;具備積極的工作態(tài)度,做事認(rèn)真負(fù)責(zé),善于溝通。
第13篇 senior asic設(shè)計(jì)工程師職位描述與崗位職責(zé)任職要求
職位描述:
主要職責(zé):
1. 定義相關(guān)ip的微結(jié)構(gòu)
2. 帶領(lǐng)整個(gè)團(tuán)隊(duì)進(jìn)行ip的開(kāi)發(fā)
崗位要求:
1. 碩士學(xué)位及5年以上相關(guān)工作經(jīng)驗(yàn)
2. 熟悉asic芯片前端設(shè)計(jì)的各個(gè)方面,包括但不限于: rtl代碼編寫,綜合,時(shí)許分析,功耗分析和dft等
3. 擁有完整的全流程ip設(shè)計(jì)的經(jīng)驗(yàn),從初始需求到最終gds
4. 擁有帶領(lǐng)5人以上團(tuán)隊(duì)開(kāi)發(fā)的經(jīng)驗(yàn)
擁有以下經(jīng)驗(yàn)優(yōu)先:
1. 相關(guān)ai芯片設(shè)計(jì)經(jīng)驗(yàn)
2. usb/ddr phy等ip使用經(jīng)驗(yàn)
3. uvm等相關(guān)使用經(jīng)驗(yàn)。
第14篇 銷售工程師ic崗位職責(zé)銷售工程師ic職責(zé)任職要求
銷售工程師ic崗位職責(zé)
職責(zé)描述:
1,銷售或獨(dú)立開(kāi)發(fā)、維護(hù)客戶,推廣產(chǎn)品,完成desin-in,desin-win;
2,處理客戶的需求、報(bào)價(jià),訂單談判及貨款回收;
3,制定產(chǎn)品銷售計(jì)劃策略,引導(dǎo)和控制產(chǎn)品銷售工作的方向和進(jìn)度,規(guī)范銷售流程,完成業(yè)績(jī)目標(biāo);
4,收集分析反饋的市場(chǎng)行業(yè)信息,開(kāi)發(fā)客戶并建立合作關(guān)系;
5,協(xié)助處理大客戶投訴結(jié)果,挖掘銷售機(jī)會(huì),拓展業(yè)績(jī);
6,做好溝通協(xié)調(diào)工作。
任職要求:
1,專科以上學(xué)歷,市場(chǎng)營(yíng)銷,通信,電子信息工程,自動(dòng)化控制等相關(guān)專業(yè);
2,熟悉ic產(chǎn)品代理銷售工作,且有二年以上電子元器件銷售經(jīng)驗(yàn);
3,具備較強(qiáng)的市場(chǎng)分析、營(yíng)銷、推廣能力,分析和解決問(wèn)題的能力和協(xié)調(diào)能力;
4,較強(qiáng)的事業(yè)心,為人正直,敢于挑戰(zhàn),能夠承擔(dān)一定的壓力 .
福利:
基本工資+提成,提成多勞多得,優(yōu)秀員工年收入在30萬(wàn)以上
1、五險(xiǎn)、周末雙休
2、每月壽星有生日紅包、生日會(huì)(下午茶或者餐后水果)
3、季節(jié)性團(tuán)隊(duì)游玩
4、節(jié)日禮品及提前下班福利(端午節(jié)、中秋節(jié)、春節(jié)等)
5、工作年限滿三年每月500元補(bǔ)貼父母的津貼
6、滿年帶薪年假
7、優(yōu)越的辦公環(huán)境和愉快輕松的企業(yè)氛圍
8、入職提供專業(yè)培訓(xùn),個(gè)人發(fā)展空間大
9、享受國(guó)家法定節(jié)假日
10、其他福利
你若來(lái),必成白富美、高富帥
工作有空調(diào)、wifi全覆蓋
老板、領(lǐng)導(dǎo)都很帥
努力賺錢快,還能談戀愛(ài) :)耶!
第15篇 ic模擬設(shè)計(jì)工程師崗位職責(zé)
模擬ic設(shè)計(jì)工程師 亨通 亨通集團(tuán)有限公司,亨通,亨通集團(tuán),亨通 職位描述
設(shè)計(jì)高速模擬/混合信號(hào)ic,完成仿真和驗(yàn)證,撰寫設(shè)計(jì)文檔;
崗位要求
1、微電子或電子相關(guān)專業(yè),碩士及以上學(xué)歷;
2、設(shè)計(jì)過(guò)adc/dac,serdes,cdr,pll中的一種或多種;
3、能熟練使用eda軟件進(jìn)行電路、版圖設(shè)計(jì)和仿真;
4、具有扎實(shí)的信號(hào)和系統(tǒng)基礎(chǔ)。
工作區(qū)域:
蘇州、新加坡
第16篇 robot service engineer機(jī)器人服務(wù)工程師崗位職責(zé)描述崗位要求
職位描述:
職責(zé)描述:
duties and responsibilities
?direct the installment and wiring of the robots on site; cooperate with team to fi_ problems arisen on site
?configure the au_iliary equipment of robots; work with team to integrate robots with the whole line
?program robots for applications of sorts, make robots working accurately and efficiently
?fi_ robots problem in both of hardware and software
?provide the customers with robots operation courses, and instruct them for regular maintenance
?support project team to analyze the configuration of robot and accessories in detail parameter, help to analyze the technical risk of the project when project initiating and even when proposal phase, and analyze technical request to supplier related to robot.
?act as technical interface to customer. (this could be added into point 5 in enclosure)
?good following up service case to end and close it
?maintain good relationships with customers through quick effective feedback
key performance indicators & measures
?behaviors of on-site service is ok with no bad result
?done the dispatching tasks by himself
?service report / service working paper
?weekly time recording
qualifications (education, training, certification, licenses, e_perience)
?college degree in mechanical or electrical engineering
?repair or maintenance e_perience in related industry area
?computer software including microsoft office and internet
?pass the c5g basic operation training and electrical training
knowledge & skills
generally level of written & oral english
behavioral competencies
?good interpersonal communication skills
職位要求: